Hitachi High-tech Ion Milling System IM4000Plus (HITACHI Ion Milling System IM4000) is a hybrid instrument with cross-section processing and surface grinding functions!
Section processing: Grind the sample section smoothly to facilitate high-resolution imaging of the structure below the surface.
Plane grinding: Grind the surface of the sample uniformly by 5 square millimeters, selectively grinding from different angles, in order to highlight the surface characteristics of the sample.
The high throughput of Hitachi Ion Milling System IM4000 (HITACHI Ion Milling System IM4000) can improve processing efficiency:
Compared with the previous model E-3500, the new ion gun design is adopted to reduce the cross-section grinding time. (Maximum processing rate: 300 microns/hour for silicon-66% reduction in processing time.)
Features
Mixed mode: two grinding configurations
Section processing: Grind the sample section smoothly to facilitate high-resolution observation of the surface
Plane grinding: selectively, large area and uniform grinding of 5 mm planes at different angles to highlight the surface characteristics of the sample
High efficiency: improve processing efficiency
Compared with the previous E-3500, the new ion gun design is adopted, which reduces the cross-section grinding time
(Maximum processing speed: 300 μm/h for silicon material-66% reduction in processing time)
Detachable sample stage:
In order to facilitate sample setting and edge grinding, the sample stage is designed to be detachable
Specifications
|
Ion Gun |
Item / Principle |
Penning Type |
|
Emission Voltage |
0 ～ 1.5 kV |
|
Accelerating Voltage |
0 ～ 6 kV |
|
Emission Current |
0 ～ 560 µA |
|
Maximum milling rate |
C/S milling |
More than 500 µm／h (Material: Si) |
|
Maximum milling rate |
Flat Milling |
Approx.2 µm／h (Material: Si) |
Cross-section Milling
|
Specimen Swinging Angle |
0°(Mode C0), ±15°(Mode C1, 2), ±30° (Mode C3, 4, 7, 8, 9)、
±40°(Mode C5, 6) |
|
Specimen Swinging Speed (Back and Forth) |
6 times ／min (Mode C1), 60 times／min (Mode C2),
3 times／min (Mode C3),
30 times ／min (Mode C4, 7, 8, 9)、
2.3 times／min(Mode C5), 23 times／min (Mode C6) |
|
Ion Beam Irradiation |
Continuous Irradiation Mode: 7 kinds (C0, C1, C2, C3, C4, C5, C6, & C7）
Intermittent Irradiation Mode: 3 kinds (Mode C7, C8, & C9) |
|
Setting Time |
00 h 01 min ～ 23 h 59 min |
|
Flat Milling |
Ｘ Moving Range (Eccentricity) |
0 ～ 5 mm |
|
Ion Beam Irradiation Angle |
0 ～ 90° |
|
Rotation Speed |
1 r／min(Mode F1), 25 r／min (Mode F2, 8) |
|
Specimen Recurrent Speed |
1.5 times／min (Mode F3), 15 times／min (Mode F4), 1 time／min (Mode F5), 10 times／min (Mode F6, 7) |
|
Specimen Recurrent Angle |
0° (Mode F0), ±60° (Mode F3, 4), ±90° (Mode F5, 6, 7) |
|
Ion Beam Irradiation |
Continuous Irradiation Mode: 7 kinds (Mode F0, F1, F2, F3, F4, F5, & F6)
Intermittent Irradiation Mode: 2 kinds (Mode F7, F8） |
|
Setting Time |
00 min 01 sec ～ 99 min 59 sec |
|
Evacuation System |
Principle |
Automatic Evacuation |
|
Main Evacuation Pump |
Turbo Molecular Pump (33L/S) |
|
Rotary Pump |
135 L／min, (162 L／min at 60 Hz) |
|
Argon Gas Control Method |
Mass Flow Controller |
|
Argon Gas Setting Range |
0 ～ 1 cm3／min |
|
Maximum Specimen Size |
C/S Milling |
W20 x D12 x H7 mm (Max. Weight 20g) |
|
Flat Milling |
Φ 50 x H25 mm (Max. Weight 430g) |
|
Power Supply |
AC 100 V(±10%), 50／60 Hz, 1.25 kVA |
|
Dimension |
W616 x D711 x H312 mm |
|
Weight |
Main Unit 48 kg, Rotary Pump 28 kg |